WORLDTECHIntel's 256-Core Xeon 7 Diamond Rapids Package Photographed for First Time
TechPowerUp has published the first photos of Intel's Xeon 7 "Diamond Rapids" package, which appears to be the first public view of the chip as actual silicon. The flagship is described as carrying up to 256 Panther Cove P-cores.
Two packages shown in Shenzhen
According to TechPowerUp, Intel brought two packages to the Tencent Global Digital Ecosystem Conference in Shenzhen on October 29. One displayed the heat spreader, while the other was turned over to expose the contact side. Photographs of both have only now begun circulating.
Intel is a semiconductor and electrical company based in Santa Clara. The packages are built for the LGA 9324 socket on Intel's Oak Stream platform, and the underside shows a large pad area that corresponds to that socket.
Design details disclosed earlier
The specifications are not new, because Intel laid out the package design at HOT CHIPS in August. The top configuration reportedly combines up to 256 Panther Cove P-cores without simultaneous multithreading, distributed over 16 compute chiplets fabricated on Intel 18A-P, together with 1.28 GB of last-level cache.
The processor also offers 16 memory channels with MRDIMM support up to 12,800 MT/s and 128 PCIe Gen 6 lanes.
Open questions
- Will the photographed packages match the final production configuration?