Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs

What happened

Intel has showcased a patent it filed in 2022 to embed MicroLEDs inside chip packaging. patent that discusses embedding MicroLEDs inside chip packaging, as TrendForce reports . Intel is a semiconductor and electrical company based in Santa Clara.

The design embeds semiconductor dies fitted with MicroLEDs directly into a glass substrate and connects them using Through-Glass-Vias (TGV) to provide power and signal connections, allowing them to emit red, green, and blue (RGB) light. The potential for this to support optical signaling is intriguing, and likely holds significant commercial potential for Intel.

AUO recently showcased Micro LED optical communication at SEMICON Taiwan 2026 , with a design goal interconnect range of up to 10 meters, targeting use in AI data centers. How Intel wants to build chips with glass In the patent, Intel describes using laser treatment and etching to create the through-holes and die cavities within the glass substrate .