Celestica Unveils DS6005 Co-Packaged Optics Switch for AI Data Centers

What happened

Celestica introduced the DS6005, a fully liquid-cooled data center (a building full of computers that runs online services) switch that delivers up to 102.4Tbps of capacity through co-packaged optics, in a company announcement dated October 12, 2026. The system is built on Broadcom's Tomahawk 6 – Davisson switch chip, and Celestica is showcasing it at the 2026 OCP Global Summit in San Jose, which runs October 12–15, 2026.

The system is built on Broadcom’s Tomahawk 6 – Davisson switch chip, and Celestica is showcasing it at the 2026 OCP Global Summit in San Jose, which runs October 12–15, 2026. The Toronto-based company described the DS6005 as a co-packaged optics (CPO) switching system designed around the bandwidth density, power, latency, and reach requirements of next-generation AI data center networks.

Celestica said the switch is purpose-built for AI and machine learning scale-up and scale-out networking, and that it reduces power consumption, lowers latency, and improves cluster efficiency and reliability in next-generation AI clusters. Gavin Cato, Celestica’s senior vice president and general manager of portfolio solutions and AI platform engineering, said AI infrastructure is driving demand for bandwidth while power, thermal management, latency, and reach become increasingly important constraints. The switch also provides support for SONiC, which Celestica said enables faster time to production on a proven, open architecture.

Key facts

• Celestica — introduced: the DS6005, a fully liquid-cooled data center switch that delivers up to 102.4Tbps of capacity through co-packaged optics, in a company announcement dated October 12, 2026
• The switch also — support: SONiC, which Celestica said enables faster time to production on a proven, open architecture