Chips & Hardware SINGLE SOURCE
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle
First reported Source: EE TimesLast editorial activity
What happened
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle, according to EE Times. Low-volume production sits between research and mass manufacturing. Europe needs an industrial model to fill the gap.
The post Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle appeared first on EE Times . Europe has no shortage of semiconductor research.
Sources & evidence
- EE Times Reporting source
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle ↗
https://www.eetimes.com/europe-advanced-packaging-gap-fraunhofer-swissbit-target-the-missing-middle/