Wiwynn Brings Vera Rubin NVL72, AMD Helios Racks to OCP Global Summit

What happened

Wiwynn Corporation unveiled its 2026 OCP Global Summit lineup on October 12, 2026, presenting NVIDIA Vera Rubin NVL72 and AMD Helios rack platforms, advanced cooling technologies, and a co-packaged optics demonstration at Booth C74 of the San Jose Convention Center. Wiwynn describes Vera Rubin NVL72 as a liquid-cooled, rack-scale system that integrates 72 NVIDIA Rubin GPUs (a chip built for many calculations at once, used for graphics and AI) and 36 NVIDIA Vera CPUs (the general-purpose processor at the centre of a computer) linked by sixth-generation NVLink. AMD is an electrical and semiconductor company based in Sunnyvale, and its products and services include computer hardware and graphics processing units. NVIDIA is a semiconductor company based in Santa Clara, and its products and services include graphics processing units.

In an announcement on its newsroom, the company said the showcase spans compute, cooling, power, and connectivity. In an announcement on its newsroom , the company said the showcase spans compute, cooling, power, and connectivity.

Lin said the company is presenting end-to-end capability from custom design through high-volume rack integration alongside continued investment in cooling, power, and optical interconnect, and that Wiwynn is committed to building next-generation AI infrastructure at scale with cloud service provider customers and ecosystem partners. Next-Generation AI Rack Platforms Wiwynn said it and Wistron are among the first NVIDIA Pilot Build Partners for the Vera Rubin NVL72 platform, covering engineering validation and design-in. Advanced Thermal Engineering The cooling portion of the booth covers on-package cooling, advanced materials, and system-level lightweight design.