FormFactor, Teradyne Enter Broad Semiconductor Test Collaboration

What happened

The release identifies FormFactor as a provider of semiconductor test and measurement technologies and Teradyne as a provider of automated test equipment and advanced robotics, and describes the collaboration as combining the two companies’ positions in probe, interface, and test technologies to accelerate AI and high-performance compute deployments. FormFactor and Teradyne have entered into a broad technology collaboration aimed at next-generation semiconductor testing, the companies said in a joint announcement on October 12, 2026, with Teradyne also agreeing to make a $300 million strategic equity investment in FormFactor common stock.

The collaboration pairs FormFactor's expertise in probe technologies, interface solutions, test engineering, and device characterization with Teradyne's automated test platforms. The collaboration pairs FormFactor’s expertise in probe technologies, interface solutions, test engineering, and device characterization with Teradyne’s automated test platforms.

According to the announcement, the collaboration is aimed at accelerating the development, validation, and high-volume production deployment of next-generation semiconductor devices and at helping customers address growing semiconductor complexity. The companies said they believe the collaboration will accelerate innovation across the semiconductor test ecosystem, from wafer (the disc of silicon that chips are cut from) to data center (a building full of computers that runs online services).