CPO Testing Faces A Moving Target Problem

What happened

CPO Testing Faces A Moving Target Problem, according to Semiconductor Engineering. Test vendors are adapting to changing connector architectures and extreme alignment tolerances as co-packaged optics heads toward mainstream. The post CPO Testing Faces A Moving Target Problem appeared first on Semiconductor Engineering .

Key Takeaways: The industry is busy developing different connector designs and laser sources, while massive data centers (a building full of computers that runs online services) with the first levels of CPO are being built. In the absence of design-for-test, companies have to test each individual waveguide, resonator or photodiode, which is inefficient and does not scale.

Optical components are much more sensitive to slight offset than electronic components, making issues like thermal and warpage particularly troublesome. Experts At The Table : The steep data center build-out contains an increasing amount of near-packaged optics (NPO) and co-packaged optics (CPO), putting pressure on test manufacturers to produce high-volume manufacturing tooling.

Key facts

• Experts At The Table : The steep data center build-out — includes: an increasing amount of near-packaged optics (NPO) and co-packaged optics (CPO), putting pressure on test manufacturers to produce high-volume manufacturing tooling