WORLDTECHChips & Hardware DEVELOPING
ASML’s chip packaging move threatens Besi shares, Bank of America says
First reported Source: The Next WebLast editorial activity
What happened
Bank of America cut BE Semiconductor Industries to neutral and nearly halved its price target, saying the share price does not reflect the threat of ASML entering hybrid bonding, the market Besi depends on for growth.
Sources & evidence
- The Next Web Reporting source
ASML’s chip packaging move threatens Besi shares, Bank of America says ↗
https://thenextweb.com/news/besi-asml-hybrid-bonding-dutch