WORLDTECH NEWS Global technology intelligence.Contact
WORLDTECH.NEWS
Search Follow
← Back to WORLDTECH
Chips & Hardware SINGLE SOURCE

Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops

First reported Source: PhoronixLast editorial activity
A sleek gaming setup featuring a high-end PC, widescreen monitor, and ergonomic chair lit by neon lights.
Illustrative photo.Photo by Ron Lach on PexelsQualcomm logo shown for identification only; no affiliation with or endorsement of WORLDTECH is implied.

What happened

Some Qualcomm SoCs (a whole computer’s parts built onto a single chip) are available in different multiple thermal/package bins with different junction temperature limits but otherwise being the same silicon. A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support.

Sources & evidence

We use only necessary storage (to remember this choice) and cookie-free, anonymous audience measurement. Optional categories (analytics, advertising, personalisation) stay off unless you accept them. No optional trackers are currently integrated. Learn more

Settings