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Copper Grain Structure Influences Stress Around Scaled TSVs (Purdue, UCLA)
First reported Source: Semiconductor EngineeringLast editorial activity
What happened
https://doi.org/10.1002/aelm.70600 The post Copper Grain Structure Influences Stress Around Scaled TSVs (Purdue, UCLA) appeared first on Semiconductor Engineering .
Sources & evidence
- Semiconductor Engineering Reporting source
Impact of Cu Microstructure On The TSV-Induced Residual Stress Within Silicon (Purdue, UCLA) ↗
https://semiengineering.com/copper-grain-structure-influences-stress-around-scaled-tsvs-purdue-ucla/