Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging

What happened

However, the challenge extends beyond smaller surface defects. How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow.

In advanced packaging, value accumulates layer by layer, component by component, and process step by process step. An undetected defect at this stage can place the larger assembly at risk.

Compounding this challenge, shrinking package features are bringing advanced packaging requirements closer to the tolerances historically associated with front-end fabrication. Advanced packaging processes can present surface, sidewall and subsurface inspection challenges, including particles, cracks, embedded defects, microbump irregularities and bonding voids.