Thermal Complexity Grows With AI Chips And Photonics

What happened

What follows are excerpts of that conversation, which was held behind closed doors at the recent Design Automation Conference. Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow.

The post Thermal Complexity Grows With AI Chips And Photonics appeared first on Semiconductor Engineering . Key Takeaways: Photonics can speed up the movement of data using less energy, but the impact of heat, warpage, and other stresses needs to be fully understood up front.

Understanding the transient behavior associated with multi-die assemblies is complex, but it opens the door to much more granular performance and thermal optimization. Tools that can accurately predict thermally accelerated aging are lacking today.