A Network-on-Chip (NoC) For Multi-Die Devices

What happened

Transporting the native packetized traffic of the NoC directly across die boundaries using a stable, invariant interface. The post A Network-on-Chip (NoC) For Multi-Die Devices appeared first on Semiconductor Engineering .

The semiconductor industry is rapidly transitioning from monolithic SoCs to chiplet-based architectures. At the same time, AI workloads are evolving beyond cloud inference (running a trained model to get an answer, rather than training it) into physical AI: systems that perceive, reason, and act in the real world.

Autonomous vehicles, industrial robots, humanoid robots, drones, and intelligent manufacturing systems all require continuous, high-volume data flow between heterogeneous compute engines. However, these two trends expose a weakness in today’s die-to-die communication architectures.