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One Substrate No Longer Rules Them All

Large dark chip package with rows of gold contacts along its edges, lying on a matte dark surfaceAI illustration
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What happened

Larger packages, finer routing, and embedded functions are pushing advanced substrates toward application-specific designs. The post One Substrate No Longer Rules Them All appeared first on Semiconductor Engineering .

Key Takeaways Larger body sizes, higher layer counts, finer routing, and embedded functions are increasingly making substrate capability application-specific. A substrate can be technically feasible but impractical at the yield or process window required for high-volume manufacturing.

As substrates specialize, the carrier systems, temporary bonding materials, and many process flows around them must specialize, as well. For years, the substrate problem was relatively easy to describe, even when it was difficult to solve.

Sources & evidence