WORLDTECH芯片与硬件 单一来源
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle
本文目前仅有英文版。
首次报道 来源：EE Times最近编辑更新
What happened
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle, according to EE Times. Low-volume production sits between research and mass manufacturing. Europe needs an industrial model to fill the gap.
The post Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle appeared first on EE Times . Europe has no shortage of semiconductor research.
来源与证据
- EE Times 报道来源
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle ↗
https://www.eetimes.com/europe-advanced-packaging-gap-fraunhofer-swissbit-target-the-missing-middle/