GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion

What happened

Volume production is scheduled to ramp up in the first half of 2028. GlobalFoundries becomes a part of TSMC's CoWoS supply chain in the U.S.: set to participate in production of leading-edge AI and HPC accelerators without investing in leading-edge process technologies. TSMC is a semiconductor company based in Hsinchu Science Park.

GlobalFoundries and TSMC have entered into a five-year manufacturing agreement valued at $2 billion under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging technology. The arrangement will establish a U.S.-based manufacturing source for these components, which will enable TSMC's clients to brand their products as completely made and packaged in America. Such interposers are custom pieces of silicon that provide high-density connections between logic chiplets and high-bandwidth memory (HBM) stacks and enable the creation of complex multi-die processors for artificial intelligence (AI) and high-performance computing (HPC) applications.