Lightspring raises €3.5M to tackle photonic chip manufacturing bottleneck

What happened

French company Lightspring today announced the close of a €3.1 million seed round led by Atlantic and OVNI Capital, with participation from Concept Ventures, Ixcore, Plug and Play Ventures, and indust... The company also announced it has been named a laureate of i-Lab, France's national deeptech innovation competition.

The round was led by Atlantic and OVNI Capital, with participation from Concept Ventures, […] The post Besançon-based Lightspring raises over €3.5 million to industrialise photonic chip packaging appeared first on EU-Startups . While photonic integrated circuit (PIC) fabrication itself is now handled by a handful of mature foundries, assembly and optical packaging alone account for roughly 50 per cent of a PIC's cost, against around 20 per cent for the foundry step.

Fibre-to-chip coupling is still done part by part, through micrometre-scale active alignment — a process that brings 2–3 dB of typical optical loss, low throughput, degraded yield, and no standard. The round was led by Atlantic and OVNI Capital, with participation from Concept Ventures, Ixcore, Plug and Play Ventures and industry business angels.

Key facts

• French company Lightspring today — announced: the close of a €3.1 million seed round led by Atlantic and OVNI Capital, with participation from Concept Ventures, Ixcore, Plug and Play Ventures, and indust
• The company also — announced: it has been named a laureate of i-Lab, France's national deeptech innovation competition