Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications

What happened

The study demonstrates how optimized plasma processing can achieve effective surface roughening and activation, providing a viable alternative to conventional KOH treatment while delivering the coverage and adhesion required for subsequent electroless copper plating. How optimized plasma processing can achieve effective surface roughening and activation.

The post Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications appeared first on Semiconductor Engineering . The challenge LCP is a high-performance engineering plastic widely used in the electronics, automotive, medical, and communications industries because of its excellent mechanical properties, thermal stability, and electrical insulation characteristics.

However, untreated LCP surfaces are extremely smooth, exhibit low surface energy, and have poor wettability. As a result, direct electroless copper plating typically cannot achieve the adhesion and coverage required for manufacturing processes.