Bambu Lab’s 3D printing patent application for a new heatbed design may improve peeling issues

What happened

Shenzhen Tuozhu Technology, Bambu Lab’s parent company, has filed a patent application in the U.S. Bambu Lab applied to patent its new heatbed design that might finally solve bed adhesion problems for large prints.

for a new heatbed design, which was published on September 10, 2026. This design aims to heat a printbed more evenly, reducing issues with prints as commonly reported by many users of various 3D printer brands.

The patent describes the construction, heating method, and its claim of better adhesion to improve print quality. The current heatbeds use a laminated heating sheet, adhered to a sheet of aluminum with magnets to hold a build plate.