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Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle
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Erstmals berichtet Quelle: EE TimesLetzte redaktionelle Änderung
What happened
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle, according to EE Times. Low-volume production sits between research and mass manufacturing. Europe needs an industrial model to fill the gap.
The post Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle appeared first on EE Times . Europe has no shortage of semiconductor research.
Quellen & Belege
- EE Times Berichtende Quelle
Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle ↗
https://www.eetimes.com/europe-advanced-packaging-gap-fraunhofer-swissbit-target-the-missing-middle/